71 lines
5.3 KiB
Plaintext
71 lines
5.3 KiB
Plaintext
(footprint "ESP01F" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(attr smd)
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(fp_text reference "REF**" (at 0 -7.62 unlocked) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.1)))
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(tstamp 75ca675f-07d4-4856-a318-ef3bf7ed60ce)
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)
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(fp_text value "ESP01F" (at 0 7.366 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 41ebaf20-60cf-430f-8070-da9b919817ed)
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)
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(fp_text user "${REFERENCE}" (at 0 8.866 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 0739e19a-8100-4b96-8edc-dc10fd80f534)
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)
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(fp_line (start -6.096 -5.842) (end 6.096 -5.842)
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(stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 88a0a2c2-b029-4c78-9aa3-0200e58fcbff))
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(fp_line (start -6.096 5.842) (end -6.096 -5.842)
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(stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 61b87292-4403-4f3c-b5bb-01651a772d53))
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(fp_line (start 6.096 -5.842) (end 6.096 5.842)
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(stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 4d6db3f8-a6c7-45d5-95de-765b083a3343))
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(fp_line (start 6.096 5.842) (end -6.096 5.842)
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(stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp e5f5fddd-36f5-477b-a3fe-10125fbb6b48))
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(fp_line (start -5 -5.5) (end 5 -5.5)
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(stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp ba508fab-faca-4919-bb7e-bdd7a505de0e))
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(fp_line (start -5 5.5) (end -5 -5.5)
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(stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 31e7dedb-aab9-440e-ab5e-c4b4d4e6fdbe))
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(fp_line (start 5 -5.5) (end 5 5.5)
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(stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 6a6cfcab-7eef-4920-a6f9-a3741d4e1c93))
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(fp_line (start 5 5.5) (end -5 5.5)
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(stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp f6ab6c22-7189-4123-83ed-9053186202f9))
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(pad "1" smd roundrect (at -5.08 -4.4) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 15072b73-cb92-4b26-b4c4-8f18fb8a30f0))
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(pad "2" smd roundrect (at -5.08 -3.3) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 29a6a780-b134-4743-b70a-3358170ff631))
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(pad "3" smd roundrect (at -5.08 -2.2) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 50725421-4b45-48e3-a5c3-59314fb34735))
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(pad "4" smd roundrect (at -5.08 -1.1) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp d804ddea-8daa-440f-ba6e-ad18c3b8581a))
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(pad "5" smd roundrect (at -5.08 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(pad "7" smd roundrect (at -5.08 2.2) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(pad "9" smd roundrect (at -5.08 4.4) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 0db2b538-41af-4b23-941e-489a1ab74004))
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(pad "10" smd roundrect (at 5.08 4.4) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 6f723eef-c5cc-4f32-9693-9c2d2294181a))
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(pad "12" smd roundrect (at 5.08 2.2) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp fd6a213e-1cd9-4ea7-b06b-2f9dfda99c4d))
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(pad "14" smd roundrect (at 5.08 0) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp aa90c59f-5a00-42d7-a72e-5bc484536b9b))
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(pad "15" smd roundrect (at 5.08 -1.1) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 5d8f8e70-b437-4a4d-9358-ff013c06af98))
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(pad "16" smd roundrect (at 5.08 -2.2) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 97bcc9ad-37c5-45fa-a153-1dd84609ed61))
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(pad "17" smd roundrect (at 5.08 -3.3) (size 1.5 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 377e1b09-6d49-4a70-ac77-abdfba5301db))
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(thermal_bridge_angle 45) (tstamp 61696ab0-a031-4dae-a340-ec4ea433fdea))
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(pad "19" smd roundrect (at 1.1 0.75) (size 3.7 3.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(thermal_bridge_angle 45) (tstamp 00965498-25d3-4d50-a7d9-a17c8df39ea1))
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)
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