(footprint "CONMHF4-SMD-G-T" (version 20221018) (generator pcbnew) (layer "F.Cu") (attr smd) (fp_text reference "REF**" (at 0 -2.415 unlocked) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.1))) (tstamp 147abe0c-c3fb-40c4-a541-e484e27a44a4) ) (fp_text value "CONMHF4-SMD-G-T" (at 0 3.15 unlocked) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp d27d2aea-1722-459e-af50-9b1b00bfead7) ) (fp_text user "${REFERENCE}" (at 0 4.65 unlocked) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp 805e0761-3748-4569-a381-4d807acb835a) ) (fp_line (start -1.524 -1.524) (end 1.016 -1.524) (stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 1b7d0470-bfab-450f-9f04-5ba65ce17511)) (fp_line (start -1.524 1.524) (end -1.524 -1.524) (stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp d7c720f2-7011-4fae-903c-282b99a05a55)) (fp_line (start 1.016 -1.524) (end 1.524 -1.016) (stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp e33b0263-3111-464b-8a95-39eddc881cf1)) (fp_line (start 1.524 -1.016) (end 1.524 1.524) (stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 0081bc0c-f49b-4689-9c56-cbbff26d965b)) (fp_line (start 1.524 1.524) (end -1.524 1.524) (stroke (width 0.1) (type default)) (layer "F.SilkS") (tstamp 27d2a6a2-0ce3-425f-b46d-8a708dba60d9)) (fp_line (start -0.84 -0.84) (end 0.42 -0.84) (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 46dbb462-97e1-4ddd-8bb5-67ad57b3de4f)) (fp_line (start -0.84 0.84) (end -0.84 -0.84) (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp e5b51395-127e-46a8-a35d-65eaada35440)) (fp_line (start 0.42 -0.84) (end 0.84 -0.42) (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 33edd27f-8807-4298-9c1d-1d8852f6ac25)) (fp_line (start 0.84 -0.42) (end 0.84 0.84) (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 9ade7922-7e34-4201-97ae-3d8a586bbfb7)) (fp_line (start 0.84 0.84) (end -0.84 0.84) (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 6e14025e-1d7f-4a40-8d9e-ee1aa0175394)) (pad "1" smd roundrect (at -0.945 0) (size 0.78 1.58) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (thermal_bridge_angle 45) (tstamp 4f09869f-ddd4-4551-8296-c2277e8a0657)) (pad "1" smd roundrect (at 0 -0.945) (size 0.5 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (thermal_bridge_angle 45) (tstamp 9d2a703a-4e18-46f9-a305-5dfe3c01db16)) (pad "1" smd roundrect (at 0.945 0) (size 0.78 1.58) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (thermal_bridge_angle 45) (tstamp 593af075-7c1f-4594-8958-d7a42632d492)) (pad "2" smd roundrect (at 0 0.945) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (thermal_bridge_angle 45) (tstamp ff6fdbf5-b290-46dd-a935-57d99cfbff13)) )